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Company
Advanced Cooling Technologies
Description
ICE-Lok®
Bill of material
25011164SideA
ORDERNO
BENEFITS
benefits
33%+ reduction in thermal resistance from equivalent size COTS wedgelocks, due to added heat transfer paths and surfacesACT's ICE-LOK System achieved a Platinum Honoree 2021 Innovator award from Military and Aerospace Electronics. Single screw access for easy board installation/removal Rugged design and construction as validated through shock/vibration testing and repeated installation cycles VITA 48.2 compliant Compatible with standard VITA 3U, 6U and 9U cards Superior clamping force Space VPX applicapable
DESCRIPTION
description
The patented Isothermal Card Edge ICE-Lok® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Compared to conventional wedgelocks, the ICE-Lok® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. The ICE-Lok thermally enhanced wedgelock, can be seamlessly integrated into standard VITA systems, enabling a longer lifetime and higher reliability for your critical components without costly board or chassis redesign.
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